Common Ball Grid Array Failures and How to Avoid Them
The BGA ball-mount process may seem uninteresting and trivial at first glance. However, the soldering steps are complex and can lead to problematic fa...
BGA
Tech Seconds: Voiding - Symptom or Defect?
How do you determine whether your voids are a symptom or a defect. Phil Zarrow gives his advice. ...
Flux Challenges Regarding Flip-Chip/BGA Balling
This video is for anyone interested in the flux challenges associated with flip-chip/BGA balling. Keywords: Phil Zarrow, Andy Mackie, Indium Corporati...
One-Step Soldering in Flip-Chip Assembly
This video is for anyone interested in flip-chip/BGA balling using the one-step assembly process. Keywords: Phil Zarrow, Andy Mackie, amackie@indium.c...
Flip-Chip/BGA Balling: Halogen-Free/Halide-Free
This video discusses the halogen-free issues of BGA/flip-chip balling. Keywords: Phil Zarrow, Andy Mackie, flip-chip, BGA, balling, halogen......
In Soldering, What is an NWO?
An NWO is a defect where the paste goes with the ball on a BGA and does not wet to the board pad....
One-Step OSP BGA Soldering Application
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...